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      Intel Corporation

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      PACKAGING R&D ENGINEER Interview

      22 Feb 2022
      Anonymous employee
      Accepted offer
      Positive experience
      Average interview

      Application

      I interviewed at Intel Corporation

      Interview

      1. 1 st round is a 30 min phone screening 2. 2nd round is an 1h presentation on research and nine 1:1 sessions. most questions are about presentation. also ask a lot of behavior questions.

      Interview questions [1]

      Question 1

      1. why do you want this job
      Answer question

      Other PACKAGING R&D ENGINEER interview reviews for Intel Corporation

      PACKAGING R&D ENGINEER Interview

      27 Apr 2022
      Anonymous employee
      Accepted offer
      Positive experience
      Average interview

      Application

      I applied online. I interviewed at Intel Corporation

      Interview

      The team was very friendly but asked keen questions from my resume. The hiring manager mostly asked questions about my fit for the position. Very constructive interview with lots of learning.

      Interview questions [1]

      Question 1

      What exactly do you expect for this role?
      Answer question

      PACKAGING R&D ENGINEER Interview

      28 Feb 2022
      Anonymous employee
      Accepted offer
      Positive experience
      Average interview

      Application

      I interviewed at Intel Corporation

      Interview

      Initial phone call interview, was described the position and asked a few questions relating to knowledge of polymer science and instrumental analysis. Then was allowed to ask a few questions back to the interviewer.

      Interview questions [1]

      Question 1

      Strengths and weaknesses? Describe an instrument, how it functions?
      Answer question

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