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      Intel Corporation

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      Physical Design Interview

      16 Aug 2013
      Anonymous employee
      Austin, TX

      Other Physical Design interview reviews for Intel Corporation

      Physical Design Interview

      11 Mar 2019
      Anonymous interview candidate
      No offer
      Neutral experience
      Difficult interview
      Accepted offer
      Positive experience
      Average interview

      Application

      I applied online. The process took 5 weeks. I interviewed at Intel Corporation (Austin, TX) in Jul 2013

      Interview

      I was contacted by an Intel personnel and was invited for an onsite.

      Interview questions [1]

      Question 1

      Rd #1: > explain the complete RTL design of Async FIFO; with individual blocks - synchronizer, counter/ pointer, comparator, memory modules > what is meat-stability and how did you resolve it in FIFO; made use of gray code pointers > given a boolean logic, was asked to implement it using only NAND gates > write pseudo code for binary search, linear search Rd #2 > explain directed testing and random testing; explained with FIFO as an example > practical scenarios wrt SOC design - how feasible it is to turn on/ off a block, voltage/ freq scaling - which one to scale first while up/ down scaling > was asked to draw the block diag of PLL and explain individual components (from resume) > how to check if a design is functionally correct; functional coverage, code coverage, random testing for bugs Rd #3 > write truth table of 2 i/p nand gate, draw transistor level diag including sizing, explain the working wrt a particular case > write pseudo code in C/C++ or SV for given problem statement > verilog code of comparator Rd #4 > resume/ course oriented questions > interconnect delay, repeater insertion etc > questions on floor planning and place and route Rd #5 > signal integrity - cross talk, IR drop, EM, Antenna effect; ways to reduce it > from resume, asked to draw floor plan of one of my projects (SRAM memory bank)
      Answer question
      6

      Application

      I interviewed at Intel Corporation

      Interview

      I applied through Intel career portal, had two telephonic interviews (1hr duration). First was mail about resume details and few fundamental questions in physical design second was about projects and device characteristics and properties, device physics

      Interview questions [1]

      Question 1

      projects, setup / hold violation and mitigation, low power design, device physics
      Answer question

      Physical Design Interview

      16 Jun 2018
      Anonymous interview candidate
      No offer
      Positive experience
      Difficult interview

      Application

      I interviewed at Intel Corporation

      Interview

      There were two rounds of phone interviews. First one lasted for 45 min with basic technical questions. I got the result of first round on the same day. And the second round lasted for 3 hours with 3 people calling me every hour with 10 min breaks in between. Second round was also completely technical with three of them asking completely different questions.

      Interview questions [1]

      Question 1

      Setup time& hold time and how to fix them, Physical design flow and its explanation
      Answer question

      Physical Design Interview

      12 Sept 2017
      Anonymous employee
      Atlanta, GA
      Accepted offer
      Positive experience
      Easy interview

      Application

      I applied through university. I interviewed at Intel Corporation (Atlanta, GA) in Sept 2016

      Interview

      Interview was fairly easy and I got the offer after 2 rounds. It was a face to face interview at my college campus. I was asked basic CMOS questions, physical design flow, layouts and verilog coding.

      Interview questions [1]

      Question 1

      Layout of an inverter, Verilog coding for a state machine, physical design flow
      Answer question