Intel Corporation Yield and Module Process Development Engineer jobs
40 results in New-Zealand
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- APTM Advanced Packaging Dry Etch Development ManagerHillsboro, ORUS$181K - US$255K (Employer provided)30d+
- 17d
- 11d
- Package Assembly Low Yield Analysis Engineer on ShiftPhoenix, AZUS$85K - US$140K (Employer provided)3d
- 5d
- Ocotillo Technology Fabrication Experienced Module EngineerPhoenix, AZUS$121K - US$232K (Employer provided)17d
- 11d
- Intel Foundry Lithography Module Development EngineerHillsboro, ORUS$134K - US$189K (Employer provided)11d
- Ocotillo Technology Fabrication Experienced Foundry Module EngineerPhoenix, AZUS$121K - US$232K (Employer provided)17d
- Advanced Packaging Technology Development Substrates Module Engineer On-Shift (Nightshift)Phoenix, AZUS$99K - US$140K (Employer provided)24h