WD Firmware Engineering Intern interview questions

It was an on-campus opportunity. It was a great interview experience. The interviewer & HR were a great aid to the smooth flow of 3 rounds of interview. First, resume eligibility were met and Coding and MCQ tests were conducted. After shortlisting, 3 rounds of interview were conducted. Round 1: Technical - Questions on OS, DBMS, DSA, Embedded systems and Microprocessors, Coding questions on DSA(Easy, Med, Hard), 3 Puzzles (Medium). Round 2: Same Round 3: Few technical and scope related questions. HR questions were asked. After the 2 month-summer internship, I got a Pre-Placement Offer based on performance. Blessed to be at WD.