Shin-Etsu Handotai interview questions

Interviewed by the technical John Anderson and Billy Scott. The QA and technical team lead. It is important to understand the silicone wafer process form grinding to the polishing process. A presentation has to be done in person for the 2nd round if you pass the 1st round.

Friendly in person interview with standard interview questions. Second interview with aptitude test and plant tour. Not too much of a challenge if you prepare appropriately. Presentation required to demonstrate communication skills, topic can be selected by applicant.