1 technical phone call, follow with 1 onsite interview with 4-5 persons. First interview was telephonic. Second was face to face, with 4 rounds of interview. 2 rounds were for SI basics (pre-silicon simulations)

First interview was telephonic. Second was face to face, with 4 rounds of interview. 2 rounds were for SI basics (pre-silicon simulations), 1 for lab related basics, 1 was with manager. This job was for end-to-end Signal integrity support with direct collaboration with package designers to board designers.