Is Micron Technology currently hiring?

Yes, Micron Technology is currently hiring for 34 open positions in New Zealand. Use Glassdoor to find and apply for a job that loves you back. Then start preparing for your job interview at Micron Technology by browsing Glassdoor's interview experience ratings and reviews, anonymously submitted by applicants and employees.

What do employees say about career development at Micron Technology?

As of July 2026, Micron Technology employees rate their career opportunities with 3.8 out of 5 stars, according to 8,838 anonymously submitted Glassdoor reviews . This rating has increased by 1% over the last 12 months.

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Micron Technology

Micron Technology R D Wet Process Eng jobs

34 results in New-Zealand

New College Grad - Wafer Bonding Process Development Engineer
Boise, ID
US$74K - US$116K (Glassdoor Est.)
30d+
Product Yield Enhancement Engineer
Boise, ID
US$87K - US$125K (Glassdoor Est.)
3d
New College Grad - ENGINEER - PYE
Boise, ID
US$65K - US$103K (Glassdoor Est.)
30d+

EUV Mask Technology R&D Engineer
Boise, ID
US$84K - US$122K (Glassdoor Est.)
18d
Product Yield Enhancement Engineer
Boise, ID
US$87K - US$125K (Glassdoor Est.)
3d
Process Engineer
Manassas, VA
US$83K - US$109K (Glassdoor Est.)
30d+
R&D Thin Films Process Development Engineer Advanced DRAM
Boise, ID
US$81K - US$104K (Glassdoor Est.)
30d+
EUV Mask BEOL R&D Engineer
Boise, ID
US$87K - US$120K (Glassdoor Est.)
18d
Principal Systems Performance Engineer – Modeling
Longmont, CO
US$170K - US$289K (Employer provided)
30d+
TD Thin Films Process Development Engineer DRAM
Boise, ID
US$78K - US$100K (Glassdoor Est.)
30d+
TEM Engineer
Boise, ID
US$96K - US$128K (Glassdoor Est.)
30d+
Realtime Defect Analysis Engineer
Boise, ID
30d+
Thin Films Advanced DRAM Process Development Engineer
Boise, ID
US$83K - US$109K (Glassdoor Est.)
30d+
Photolithography Process Development Engineer
Boise, ID
US$76K - US$96K (Glassdoor Est.)
30d+
Sr. Engineer, Photo DRAM
Boise, ID
30d+
R&D Dry Etch Process Development Engineer
Boise, ID
US$87K - US$121K (Glassdoor Est.)
30d+
Sr BEOL Engineer - DRAM Process Integration
Boise, ID
US$76K - US$112K (Glassdoor Est.)
30d+
Senior/Principal Dry Etch Engineer
Boise, ID
US$92K - US$154K (Glassdoor Est.)
30d+
Thin Films Advanced DRAM Process Development (Open)
Boise, ID
30d+
MTS/Principal Engineer, Metals Adv DRAM
Boise, ID
US$110K - US$159K (Glassdoor Est.)
30d+
Principal Process Engineer, Die Bonding
Boise, ID
30d+
Sr. Engineer, Photo DRAM
Boise, ID
US$70K - US$110K (Glassdoor Est.)
30d+
AI Strategy, Emerging Systems & AI Principal Architect
Boise, ID
US$179K - US$244K (Glassdoor Est.)
30d+
Principal/MTS Chemistry Development Engineer, 3D DRAM Wet Etch
Boise, ID
US$97K - US$145K (Glassdoor Est.)
30d+
Design Architecture, Member of Technical Staff,HBM
San Jose, CA
US$171K - US$230K (Glassdoor Est.)
30d+
Staff Equipment Development Engineer - Advanced Packaging
Boise, ID
US$65K - US$91K (Glassdoor Est.)
30d+
STAFF ENGINEER, PHOTO DRAM
Boise, ID
30d+
Semiconductor Process Engineer 4
Boise, ID
US$94K - US$122K (Glassdoor Est.)
30d+
Manager Systems Design and Architecture
Richardson, TX
US$135K - US$187K (Glassdoor Est.)
26d
ENGINEER, ID1 DRAM PI
Boise, ID
US$93K - US$124K (Glassdoor Est.)
30d+
Staff Engineer, APTD Dry Etch
Boise, ID
US$74K - US$116K (Glassdoor Est.)
30d+
Principal CAD Engineer, Central Engineering
Richardson, TX
US$98K - US$143K (Glassdoor Est.)
30d+
Sr RDA Engineer, Advanced Packaging
Boise, ID
US$65K - US$105K (Glassdoor Est.)
30d+
Senior RDA Engineer, APTD
Boise, ID
US$91K - US$135K (Glassdoor Est.)
30d+

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