Is Micron Technology currently hiring?

Yes, Micron Technology is currently hiring for 58 open positions in New Zealand. Use Glassdoor to find and apply for a job that loves you back. Then start preparing for your job interview at Micron Technology by browsing Glassdoor's interview experience ratings and reviews, anonymously submitted by applicants and employees.

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As of July 2026, Micron Technology employees rate their career opportunities with 3.8 out of 5 stars, according to 8,837 anonymously submitted Glassdoor reviews . This rating has increased by 1% over the last 12 months.

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Micron Technology

Micron Technology R&D Process Integration Engineer jobs

58 results in New-Zealand

Photomask R&D Process Integration Engineer
Boise, ID
US$93K - US$131K (Glassdoor Est.)
30d+
Metrology Process Engineer – Technology Development
Albany, NY
US$89K - US$182K (Employer provided)
8d
DRAM Process Integration Engineer
Boise, ID
US$88K - US$115K (Glassdoor Est.)
4d

Sr Metrology Process Engineer, Technology Development
Albany, NY
US$89K - US$224K (Employer provided)
30d+
Process Integration Engineer | APTD
Boise, ID
US$81K - US$109K (Glassdoor Est.)
30d+
R&D Dry Etch Process Development Engineer
Boise, ID
US$87K - US$121K (Glassdoor Est.)
30d+
Process Integration Engineer - DRAM, DMTS
Boise, ID
30d+
Process Integration Engineer | APTD
Boise, ID
US$81K - US$109K (Glassdoor Est.)
30d+
DRAM Process Integration Engineer
Boise, ID
US$88K - US$115K (Glassdoor Est.)
30d+
Advanced DRAM Process Integration Engineer
Boise, ID
US$91K - US$123K (Glassdoor Est.)
30d+
Semiconductor Process Engineer - Photo
Albany, NY
US$107K - US$182K (Employer provided)
30d+
Sr BEOL Engineer - DRAM Process Integration
Boise, ID
US$76K - US$112K (Glassdoor Est.)
30d+
R&D Thin Films Process Development Engineer Advanced DRAM
Boise, ID
US$81K - US$104K (Glassdoor Est.)
30d+
DRAM Process Integration Engineer
Boise, ID
US$88K - US$115K (Glassdoor Est.)
30d+
Advanced DRAM Process Integration Engineer
Boise, ID
US$91K - US$123K (Glassdoor Est.)
30d+
Pathfinding Device Integration Engineer
Boise, ID
US$91K - US$137K (Glassdoor Est.)
30d+
Sr. Process Integration Engineer - DRAM
Boise, ID
US$87K - US$114K (Glassdoor Est.)
30d+
Dry Etch Process Develop Engineer
Albany, NY
US$107K - US$182K (Employer provided)
30d+
New College Grad - Pathfinding Device Integration Engineer
Boise, ID
US$84K - US$129K (Glassdoor Est.)
30d+
Dry Etch Process Develop Engineer
Albany, NY
US$107K - US$182K (Employer provided)
30d+
Dry Etch Process Development Engineer
Boise, ID
30d+
Pathfinding Device Integration Engineer
Boise, ID
US$91K - US$137K (Glassdoor Est.)
30d+
Staff Process Engineer, APTD Bonding
Boise, ID
US$96K - US$128K (Glassdoor Est.)
30d+
Principal Diffusion Process Development Engineer, DRAM
Boise, ID
US$94K - US$134K (Glassdoor Est.)
30d+
EUV Mask BEOL R&D Engineer
Boise, ID
US$87K - US$120K (Glassdoor Est.)
17d
Principal Process Engineer, Die Bonding
Boise, ID
30d+
Senior Industrial Engineer – AI Enablement
Boise, ID
US$87K - US$114K (Glassdoor Est.)
12d
SMTS Process Engineer RDA /Metrology
Boise, ID
US$120K - US$167K (Glassdoor Est.)
30d+
Principal Engineer Photolithography DRAM Process Development (Evergreen)
Boise, ID
US$77K - US$110K (Glassdoor Est.)
16d
Senior Process Integration DRAM, PI Technician
Boise, ID
US$69K - US$104K (Glassdoor Est.)
30d+
Process Integration Lead, APTD
Boise, ID
US$103K - US$141K (Glassdoor Est.)
30d+
Process Integration Lead, APTD
Boise, ID
US$103K - US$141K (Glassdoor Est.)
30d+
Engineer, Product Architecture
San Jose, CA
US$112K - US$238K (Employer provided)
30d+
Sr. Engineer, Photo DRAM
Boise, ID
30d+
Metrology Engineer - DRAM
Boise, ID
US$87K - US$128K (Glassdoor Est.)
30d+
High NA EUV - Scanner Engineer
Albany, NY
US$108K - US$183K (Employer provided)
30d+
Semiconductor Facilities Engineer
Boise, ID
US$80K - US$107K (Glassdoor Est.)
30d
Equipment Engineer
Boise, ID
US$82K - US$100K (Glassdoor Est.)
30d+
ENGINEER, DEMQRA AUTOMOTIVE PQRE
Boise, ID
24d
Staff Engineer, APTD Dry Etch
Boise, ID
US$74K - US$116K (Glassdoor Est.)
30d+

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